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Reversible Motor drive IC Series for Brush Motors
Reversible Motor Drivers for 0.8A or less (1 Motor)
BA6950FS, BA6951FS
Overview These drivers are reversible motor drivers that can directly drive brush motor which require forward and reverse rotations. Four modes of output setting are available by the use of input logic (2 inputs); forward, reverse, stop (idling), and braking. In addition, since voltage applied to motors varies in accord with the control terminal, motor rotating speed can be optionally set and by the built-in current feedback amplifier, the motor can be driven at a constant speed.
No.10008EBT01
Features 1) Four-mode outputs of forward, reverse, stop (idling), and braking are enabled in compliance with two inputs 2) Motors can be driven at a constant speed by a current feedback amplifier 3) Built-in thermal shutdown circuit 4) Built-in current limiting function (BA6951FS)
Applications Audio-visual equipment; PC peripherals; Car audios; Car navigation systems; OA equipments
Absolute maximum ratings (Ta=25C, All voltages are with respect to ground) Parameter Supply voltage Supply voltage Output current Operating temperature Storage temperature Power dissipation Junction temperature Symbol VCC VB IOMAX TOPR TSTG Pd Tjmax 0.4*
1
Ratings BA6950FS 8 18 0.8* -20 ~ 75 -55 ~ 150 0.813* 150
2 1
BA6951FS
Unit V V A C C W C
*1 Do not, exceed Pd or ASO. *2 SSOP-A16 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 6.4mW/C above 25C.
Operating conditions (Ta=25C) Parameter Supply voltage Supply voltage VTCL voltage Symbol VCC VB VCTL Ratings 3~6 3 ~ 16 0 ~ (VCC-1.8) Unit V V V
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1/9
2010.02 - Rev.B
BA6950FS, BA6951FS
Electrical characteristics (BA6950FS, unless otherwise specified, Ta=25C and VCC=4.8V, VB=4.8V) Parameter Supply current 1 Supply current 2 Supply current 3 Input threshold voltage H Input threshold voltage L Input bias current CTL amplifier offset voltage CTL amplifier gain CTL output mirror ratio 1 CTL output mirror ratio 2 CS amplifier offset voltage CS output mirror ratio 1 CS output mirror ratio 2 Output high voltage Output saturation voltage H Output saturation voltage L Symbol ICC1 ICC2 IBOFF VR/F H VR/F L IR/F H VCTLOFS VCTLGA ICTLR1 ICTLR2 CSOFS ICSR1 ICSR2 VH VOH VOL Limits Min. 2.0 0 -5 40 0.85 0.90 -5 0.85 0.90 2.0 Typ. 4.0 0.7 0 80 0 46 1.00 1.00 0 1.00 1.00 4.6 0.09 0.07 Max. 6.0 1.5 1 VCC 0.8 135 5 52 1.15 1.10 5 1.15 1.10 0.3 0.2 Unit mA mA A V V A mV A/V ratio ratio mV ratio ratio V V V FIN=2V, RIN=2V
Technical Note
Conditions FWD/REV mode, VCTL=0V Standby mode, VCTL=0V VCC=0V
VCTL-RC, VCTL=0V, 1V IRT1, VCTL=2V, 1V IRT1/IRC, IRC=20A IRT1/IRC, IRC=200A CS1-CS2, CS1=0V, 0.1V IRT2/ICS2, ICS=20A IRT2/ICS2, ICS=200A M1, M2, VCTL=0.2V IO=50mA, RT1=VCC IO=50mA, RT1=VCC
Electrical characteristics (BA6951FS, unless otherwise specified, Ta=25C and VCC=4.8V, VB=4.8V) Parameter Supply current 1 Supply current 2 Supply current 3 Input threshold voltage H Input threshold voltage L Input bias current CTL amplifier offset voltage CTL amplifier gain CTL output mirror ratio 1 CTL output mirror ratio 2 CS amplifier offset voltage CS output mirror ratio 1 CS output mirror ratio 2 TL-RAOFS offset voltage Output high voltage Output saturation voltage H Output saturation voltage L Symbol ICC1 ICC2 IBOFF VR/F H VR/F L IR/F H VCTLOFS VCTLGA ICTLR1 ICTLR2 CSOFS ICSR1 ICSR2 TL-RAOFS VH VOH VOL Limits Min. 2.0 0 -5 40 0.85 0.90 -5 0.85 0.90 6 1.85 Typ. 4.0 0.7 0 80 0 46 1.00 1.00 0 1.00 1.00 18 2.20 0.28 0.32 Max. 6.0 1.5 1 VCC 0.8 135 5 52 1.15 1.10 5 1.15 1.10 30 2.55 0.56 0.64 Unit mA mA A V V A mV A/V ratio ratio mV ratio ratio mV V V V FIN=2V, RIN=2V VCTL-RC, VCTL=0V, 1V IRT1, VCTL=2V, 1V IRT1/IRC, IRC=20A IRT1/IRC, IRC=200A ATC-CS, ATC=0V, 0.1V IRT2/ICS, ICS=20A IRT2/ICS, ICS=200A TL=0.3V, RATC=1.0 M1, M2, VCTL=1.0V IO=300mA, RT1=VCC IO=300mA, RT1=VCC Conditions FWD/REV mode, VCTL=0V Standby mode, VCTL=0V VCC=0V
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2/9
2010.02 - Rev.B
BA6950FS, BA6951FS
Electrical characteristic curves (Reference data)
5 0.9 0.4
Technical Note
Circuit Current: Icc2 [mA] _
Supply Current: Icc1 [mA]_
4
Circuit Current: Icc3 [A] _
0.8
0.3
0.7 -20C 25C 75C
3
0.2
0.6
-20C 25C 75C
2
-20C 25C 75C
0.5
0.1
1 3 4 5 6 Supply Voltage: Vcc [V]
0.4 3 4 5 6 Supply Voltage: Vcc [V]
0.0 3 4 5 6 Supply Voltage: VB [V]
Fig.1 Supply current 1 (Forward) (BA6950FS)
5
Fig.2 Supply current 2 (Standby) (BA6950FS)
0.9 Input Bias Current: IR/F H [A] _ 400
Fig.3 Supply current 3
4
Circuit Current: Icc2 [mA] _
Supply Current: Icc1 [mA]_
0.8
300
0.7 -20C 25C 75C
3
200
0.6
2
-20C 25C 75C
0.5
100
-25C 25C 75C
1 3 4 5 6 Supply Voltage: Vcc [V]
0.4 3 4 5 6 Supply Voltage: Vcc [V]
0 0 1 2 3 4 5 Input Voltage: VR/F [V]
Fig.4 Supply current 1 (Forward) (BA6951FS)
5.0 Output High Voltage: VOH [V] _
Fig.5 Supply current 2 (Standby) (BA6951FS)
1.0 Output High Voltage: VOH [V] _ 75C 25C -25C 5.0
Fig.6 Input bias current
4.8 -20C 25C 75C
Output Low Voltage: VOL [V] _
0.8
4.0
4.6
0.6
3.0 75C 25C -25C
4.4
0.4
2.0
4.2
0.2
1.0
4.0 0 0.1 0.2 0.3 0.4 Output Current: Iout [A]
0.0 0 0.1 0.2 0.3 0.4 Output Current: Iout [A]
0.0 0 1 2 3 4 Input Voltage: VR/F [V]
Fig.7 Output saturation voltage H (BA6950FS)
5.0 Output High Voltage: VOH [V] _
Fig.8 Output saturation voltage L (BA6950FS)
1.0 75C 25C -25C
1.0 Pd [W] 1.5
Fig.9 Input threshold voltage
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glas s-epox y board)
4.8 -20C 25C 75C
Output Low Voltage: VOL [V] _
0.8
i) Package only
4.6
0.6
ii) 0.813W
4.4
0.4
0.5
i) 0.625W
4.2
0.2
4.0 0 0.2 0.4 0.6 0.8 Output Current: Iout [A]
0.0 0 0.2 0.4 0.6 0.8 Output Current: Iout [A]
0.0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE [C]
Fig.10 Output saturation voltage H (BA6951FS)
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Fig.11 Output saturation voltage L (BA6951FS)
Fig.12 Thermal derating curve (SSOP-A16)
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2010.02 - Rev.B
BA6950FS, BA6951FS
Block diagram and pin configuration BA6950FS
Technical Note
VCC C5 FIN RIN
12
VCC
TSD
6 7
VB M1 M C6 C3
10 CTRL 5 PRE DRIVER 1 CTRL AMP CS AMP RC 3 PCT R1 4 CS2 C1 14 R4 RT2 15 RT1 16 R2 R3 PC 11 C2 R5 CS1 13 ATC 8 x4
9
M2
GND
C4
VCTL
2
Fig.13 BA6950FS
Table 1 BA6950FS Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Name GND VCTL RC PCT RIN VB M1 ATC M2 FIN PC VCC CS1 CS2 RT2 RT1 GND Control input Control gain setting CTL amp phase compensation Control input (reverse) Power supply (driver stage) Driver output Current sense pin Driver output Control input (forward) Phase compensation Power supply (small signal) CS amp gain setting CS amp gain setting CTL amp gain setting CTL amp gain setting Fig.14 BA6950FS (SSOP-A16)
GND VCTL RC PCT RIN VB M1 ATC RT1 RT2 CS2 CS1 VCC PC FIN M2
Function
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4/9
2010.02 - Rev.B
BA6950FS, BA6951FS
Block diagram and pin configuration BA6951FS
Technical Note
VCC C5 FIN RIN
12
VCC
TSD
6 7
VB M1 M C6 C3
10 CTRL 5 PRE DRIVER 1 CTRL AMP CS AMP RC 3 PCT R1 4 CS C1 14 R4 RT2 15 RT1 16 R2 R3 PC 11 C2 TL AMP TL 13 ATC 8 R5 x4
9
M2
GND
C4
VCTL
2
Fig.15 BA6951FS
Table 2 BA6951FS Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Name GND VCTL RC PCT RIN VB M1 ATC M2 FIN PC VCC TL CS RT2 RT1 GND Control input Control gain setting CTL amp phase compensation Control input (reverse) Power supply (driver stage) Driver output Current sense pin Driver output Control input (forward) Phase compensation Power supply (small signal) Torque limiter setting CS amp gain setting CTL amp gain setting CTL amp gain setting Fig.16 BA6951FS (SSOP-A16)
GND VCTL RC PCT RIN VB M1 ATC RT1 RT2 CS TL VCC PC FIN M2
Function
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5/9
2010.02 - Rev.B
BA6950FS, BA6951FS
External application components
Technical Note
1) Resistor for the current sensing, R5 This is a current sensing resistor, care must be taken to avoid changes in the ground wire pattern in any external connected component. 2) Control amplifier gain setting resistor, R1 VCTL pin voltage is buffered to RC pin, and the control gain - VCTLGA - can be set by connecting R1. The current decided here is output to RT1 pin. 3) Control amplifier phase compensation capacitor, C1 This phase compensation capacitor for the control amplifier. Please monitor the RT1 pin voltage and confirm no oscillation. About 33pF is recommended. 4) Current feedback amplifier gain setting resistor, R4 CS1 pin voltage (the motor current detection) is buffered to CS2 pin - BA6950FS. ATC pin voltage (the motor current detection) is buffered to CS pin - BA6951FS. The current feedback gain can be set by R4 connecting to CS2 or CS pin. The current decided here is output to RT2 pin. 5) Pre-amplifier gain setting resistor, R2, R3 These resistors are to add the control amplifier output and the current feedback amplifier output. This amplifier has about fourfold gain. 6) Pre-amplifier phase compensation capacitor, C2 Please connect the capacitor about 0.1F as the phase compensation of the pre-amplifier, and monitor the driver output no oscillation. 7) Stabilization capacitor for the power supply line, C5, C6 Please connect the capacitor of 1F to 100F for the stabilization of the power supply line, and confirm the motor operation. 8) Phase compensating capacitor, C3, C4 Noise is generated in output pins or oscillation results in accord with the set mounting state such as power supply circuit, motor characteristics, PCB pattern artwork, etc. As noise oscillation measures, connect 0.01F to 0.1F capacitors. 9) Torque limiter setting, TL pin, BA6951FS only The motor current is limited so that ATC pin voltage should not exceed TL pin voltage.
Functional descriptions Table 3 Logic table FIN L H L H RIN L L H H M1 OPEN* L H L M2 OPEN* H L L Operation Stop (idling) Forward (M2 > M1) Reverse (M1 > M2) Brake (stop)
* OPEN is the off state of all output transistors. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay.
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6/9
2010.02 - Rev.B
BA6950FS, BA6951FS
External application components setting procedure The relation between VCTL and the output high voltage is as follows. * IRT1 = VCTL / R1 * IRT2 = IACT x R5 / R4 * VRT1 = R3 x ( IRT1 + IRT2 ) + R2 x IRT1 * VMX = 4 x VRT1 VMX = 4 ( R2 + R3 ) R1 x VTCL + ***** (1) ***** (2) ***** (3) ***** (4) 4 R3 R5 R4 VCTL: Torque control voltage IACT: Motor current VM1, VM2: Output high voltage ***** (5)
Technical Note
x IACT
To drive the motor by constant speed as follows. RL + RON + R5 = 4 R3 R5 R4 ***** (6) RL: Motor coil impedance RON: On resistance of the driver IC
R3, R4, and R5 are first set, and then R1 and R2 are set afterwards. Table 4 External components Parts R1 R2 + R3 R4 R5 C1 C2 C3, C4 C5, C6 Default value 22k 1k + 1.5k 560 5.5 33pF 0.1F 0.1F 1~100F Parameter IRT1 VRT1 IRT2 VATC VPCT VPC VM1, VM2 VCC, VB Please confirm the motor operation Recommended condition IRT1 < 1mA VRT1 x 4 < VB IRT2 < 1mA VATC < 1V
Interfaces
FIN RIN 13.5k 3.6k 24k 10k 10k 10k VCTL 1k 1k 20k 1k PCT RC PC
Fig. 17 FIN, RIN
Fig.18 VCTL, RC, PCT
Fig.19 PC
VB 1k 1k 1k CS1 RT1 RT2 1k CS2 1k CS ACT TL M1 M2
Fig. 20 RT1, RT2
Fig.21 CS1, CS2 (BA6950FS)
Fig.22 CS, TL (BA6951FS)
Fig.23 VB, ACT, M1,M2
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7/9
2010.02 - Rev.B
BA6950FS, BA6951FS
Notes for use
Technical Note
1) Absolute maximum ratings Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important to consider circuit protection measures - such as adding fuses - if any value in excess of absolute maximum ratings is to be implemented. 2) Connecting the power supply connector backward Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply lines, such as adding an external direction diode. 3) Power supply lines Return current generated by the motor's Back-EMF requires countermeasures, such as providing a return current path by inserting capacitors across the power supply and GND (10F, ceramic capacitor is recommended). In this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors - including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage clamping diode across the power supply and GND. 4) Electrical potential at GND Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to determine whether there is any terminal that provides voltage below GND, including the voltage during transient phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set's reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the same way, care must be taken to avoid changes in the GND wire pattern in any external connected component. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error, or if pins are shorted together. 7) Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with electromagnetic fields. 8) ASO - Area of Safety Operation When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 9) Built-in thermal shutdown (TSD) circuit The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. 10) Capacitor between output and GND In the event a large capacitor is connected between the output and GND, if VCC and VIN are short-circuited with 0V or GND for any reason, the current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 0.47F between output and GND.
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2010.02 - Rev.B
BA6950FS, BA6951FS
Technical Note
11) Testing on application boards When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress. Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 12) Switching of rotating direction (FWD/REV) When the rotating direction is changed over by the motor rotating condition, switch the direction after the motor is temporarily brought to the BRAKE condition or OPEN condition. It is recommended to keep the relevant conditions as follows: via BRAKE: Longer than braking time*.
(* the time required for the output voltage to achieve potential below GND when brake is activated.)
via OPEN: The time longer than 1 ms is recommended. 13) Regarding the input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin.
Pin A Resistor Pin A
P+ N P P+
Pin B
C
B E
Transistor (NPN)
Pin B
N
N
Parasitic element
N
P+
N P P+ N
B
C E
P substrate Parasitic element
GND
P substrate Parasitic element
GND GND GND
Parasitic element
Other adjacent elements
Appendix: Example of monolithic IC structure
Ordering part number
B
A
6
Part No. 6950 6951
9
5
0
F
S
-
E
2
Part No.
Package FS: SSOP-A16
Packaging and forming specification E2: Embossed tape and reel
SSOP-A16
6.6 0.2 (MAX 6.95 include BURR)
16 15 14 13 12 11 10 9

Tape Quantity Embossed carrier tape 2500pcs E2
The direction is the 1pin of product is at the upper left when you hold
6.20.3
4.40.2
Direction of feed
0.3MIN
( reel on the left hand and you pull out the tape on the right hand
)
1
2
3
4
5
6
7
8
1.50.1
0.15 0.1
0.11
0.8
0.1
0.36 0.1
1pin
(Unit : mm)
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
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2010.02 - Rev.B
Notice
Notes
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